Sn63 / Pb37 Flux Core Solder Hlau

Muaj-Qib Eutectic Soldering Solution|Direct Factory Supply
Sn63/Pb37 flux core solder hlau yog siab -purity eutectic alloy muaj li ntawm 63% tin (Sn) thiab 37% txhuas (Pb). Engineered rau siab -kev cia siab rau electronics manufacturing, PCB rework, thiab industrial harness sib dhos, no alloy hloov ncaj qha los ntawm cov kua rau cov khoom ntawm ib tug meej kub taw tes ntawm 183℃(361℃F) tsis muaj ib tug nruab nrab ntawm cov yas theem.

Tus cwj pwm ntawm melting ntse no tshem tawm cov semi- cov khoom slush cheeb tsam pom nyob rau hauv cov uas tsis yog - eutectic solders, tiv thaiv kev cuam tshuam cov pob qij txha thiab txias solder defects thaum lub sij hawm siab - ceev ntau lawm cycles.

1. Eutectic Thermal Behavior (183℃Melting Point)
Instant Solidification:Qhov tseeb 63/37 piv ua kom khov tam sim ntawd thaum txias, tiv thaiv kev ntxhov siab lossis hloov cov khoom siv thaum lub sijhawm siv hluav taws xob thiab phau ntawv soldering.
Minimized Rework:Predictable melting kinetics txo qis cov khoom tsis xws luag tshwm sim los ntawm tus neeg teb xov tooj inconsistency los yog ntev tshav kub raug.

2. Homogeneous Flux Core Distribution
Internal Void Control:Tsim los ntawm ntau-theem teeb duab nrog kev txhaj tshuaj txuas ntxiv inline flux kom tswj tau cov tub ntxhais sib luag ntawm cov spool sab nrauv mus rau cov txheej sab hauv, tiv thaiv cov pob qij txha qhuav lossis kev tshaib plab.
Oxide tshem tawm:Rosin-raws li cov qauv tsim tawm ua kom lub ntsej muag tooj liab oxides thiab qis dua qhov sib txuas ntawm lub ntsej muag thaum ua kom sov.
Muaj Flux Qib:

• Rosin / RMA: Kev ua haujlwm nruab nrab rau cov khoom siv hluav taws xob dav dav thiab tooj liab substrates.
• Tsis yog- Huv si: Cov ntsiab lus qis halide nrog tsawg, tsis yog - conductive, thiab tsis yog -corrosive post- soldering residue.
• Dej-Soluble: Kev ua haujlwm siab rau kev ntub dej sai, tshem tau los ntawm cov tshuab ntxuav dej.

3. Kev ntub dej thiab kis tau zoo

• Ua kom pom kev nrawm nrawm ntawm cov txheej txheem hluav taws xob hauv substrates, suav nrog tooj liab PCB ncoo, ua ntej -tinned tivthaiv, tooj dag terminals, thiab pins connector.
• Kev ntub dej txaus txo qis tag nrho cov khoom siv sib koom ua ke thiab tsim cov txheej txheem intermetallic ruaj khov rau cov khoom siv hluav taws xob ruaj khov.

4. Dimensional Tolerance & Txheej Txheem Stability
Precision Hlau Drawing:Extruded rau nruj mechanical txoj kab uas hla tolerances (+/-0.02mm), kom ntseeg tau tias du, jam- pub dawb nyob rau hauv tsis siv neeg soldering chaw nres tsheb thiab laser-pab tshuab.
Kev txo qis qis:Optimized flux-rau-hlau ratios tiv thaiv cov roj ntau dhau, txo cov flux spattering thiab tsim cov pa luam yeeb ntawm lub chaw ua haujlwm.

Peb qhov chaw tsim khoom siv tswj cov txheej txheem nruj kom lav ntau ntau - mus rau - ntau qhov sib xws rau cov neeg xa khoom thoob ntiaj teb thiab qib- ib lub tuam txhab:

High -Purity Raw Materials:Tsim tshwj xeeb siv cov thawj electrolytic tin thiab lead ingots, ua kom cov kab tsis huv (Cu, Bi, Sb, Al) nruj me ntsis raws li cov qauv thoob ntiaj teb.

Spectrometric Verification:Txhua alloy yaj yog soj ntsuam ntawm optical emission spectroscopy los xyuas qhov tseeb 63/37 piv ua ntej xaim extrusion.

Nruam Inline Monitoring:Kev tshuaj xyuas tsis siv neeg tshawb xyuas cov kab hlau kab, ovality, thiab cov feem pua ​​flux txuas ntxiv kom tshem tawm cov voids sab hauv thiab cov hnab ntim khoob khoob khoob.

Txhawm rau txhawb nqa cov tswv lag luam thiab loj - cov neeg xa khoom loj, peb muab cov kev pab cuam hloov kho kom haum: